鄰甲酚醛環(huán)氧樹脂，由于其分子結(jié)構(gòu)中具有多環(huán)氧基結(jié)構(gòu)，固化后生產(chǎn)交聯(lián)鍵多而緊密的結(jié)構(gòu)，因而其固化產(chǎn)物具有優(yōu)良的熱穩(wěn)定性、機械輕度、電絕緣性和耐化學(xué)品性。主要用于為電子行業(yè)，被廣泛應(yīng)用于半導(dǎo)體器件、集成電路等封裝材料。
O-methylphenolic epoxy resin has many epoxy base structures in its molecular structure and many and close cross-linked bonds after curing, so its cured products have excellent thermal stability, mild mechanical strength, electrical insulation and chemical resistance. Mainly used in the electronic industry, it is widely used in semiconductor devices, integrated circuits and other packaging materials.
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